Latent reactive film formulated with Dispercoll® U: About Bayer MaterialScience Bayer MaterialScience is one of the world's largest polymer producers with sales of 10.2 billion euros (continued) in 2006. Its business scope focuses on the development of high-tech polymer materials and innovative solutions for many areas of daily life. The industries served include: automotive, electronics and electrical, construction and sports and leisure. At the end of 2006, Bayer MaterialScience had 30 production sites and approximately 14,900 employees worldwide. Bayer MaterialScience is part of the Bayer Group. Agitated Tank Reactor,Chemical Reactor Tank,Stainless Steel Bioreactor,High Pressure Tank Wuxi Zhanghua Pharmaceutical Equipment Co. Ltd , https://www.wxzhanghua.com
New bonding method
Leverkusen – Latent reactive adhesive film or film with a latent reaction adhesive layer simplifies many industrial processes. The film is prepared by applying a water-based latent reactive dispersing adhesive to a carrier or technical film and then drying. At present, Bayer MaterialScience's experts in adhesive raw materials have stated that the drying process can be carried out at about 70-90 ° C regardless of the activity of the latent reactive adhesive or film. The temperature of the adhesive film can be as high as 50 ° C without initiating a cross-linking reaction of the polymer. In the test, Bayer experts achieved a belt speed of about 1 m/min per meter length. According to Jörg Büchner, Business Unit for Coatings, Adhesives and Sealants, “This marks a critical step in the transition from innovative bonding concepts to latent reactive film applications.â€
The Lohmann film team in Neuwied, Germany, is working on the latent reactive film with a latent reactive hardener and Dispercoll® U. This film can still be used in a typical heat activation process after six months of storage.
This makes it easy to bond parts without the need for a liquid adhesive. Industrial users can purchase a special pre-coated film directly, or place a separate reactive adhesive film between the substrates, and then heat at least 70 ° C to squeeze the material to be bonded - that is, permanent bonding. In addition, a latent reaction type film with an imprint may be used for the precisely set bonding surface and bonding size.
Büchner said: "Latent reactive films can also replace reactive hot melt adhesives." These hot melt adhesives can be melted at higher temperatures and applied to the surface of the substrate. However, in this bonding process, the polymer contained in the hot melt adhesive requires moisture to crosslink. Conversely, the latent reaction film itself contains the components required for the crosslinking reaction, and only heat activation is required. Based on the existing two-component technology, the film is particularly resistant to heat and hydrolysis. This latent reaction system is more environmentally friendly due to the absence of solvents.