For many years, many people in the industry believe that metering is a non-value added expense, but with the increasing importance of metrology in the device manufacturing process, it is quickly becoming one of the key factors in helping to obtain huge revenues. In a comprehensive and comprehensive seminar paper, the reasons behind the shift in focus were clearly described. For those who produce or use metrology in various inspection, measurement, and test applications, this The dissertation should be regarded as one of the most important references. Through the discussion of "value-added" measurement, the paper's lead author, Benjamin Bunday of the International Society of Semiconductor Manufacturers (ISMI), and collaborators from ISMI and Sematech, Freescale, Advanced Micro Devices, Intel, Spansion, Texas Instruments, and IBM Together, they explained why measuring traditional measurement as a non-value added expense has become a misleading and dangerous conclusion. As Bunday said: “Various important technological trends in the current state of the art, such as optical proximity correction (OPC), design for manufacturability (DFM), and advanced process control (APC), are all based on errors. In terms of accuracy, this assumption can be finely adjusted." Bunday and co-authors explain why such examples can be found everywhere in the field of feature size measurement and overlay accuracy, film and defect metrology. Using APC as an example, they showed how this new concept makes the measurement play a major role in the quality of the final product: “In the past, the results of the measurement and monitoring process were measured, and the main purpose was to perform rework after abnormal deviations and afterwards. 'Adjusting the process. APC pushed it to a new level, constantly guiding the process to the goal through 'in-process correction'." This paper analyzes a typical grid layer APC cycle in which metering data are fed back to It is used to adjust the lithography settings, and at the same time is feedforward to adjust the gate lithography based on the lithography results; the rapid thermal annealing implantation step is finely adjusted to further correct any abnormal deviation that may occur in the gate etching step. In lithography process modeling and OPC calibration and verification - all of which are the basis for continuous progress from one node to another - metrology has become critical. "If you do not use lithography modeling and resolution enhancement techniques, the development of modern technology is absolutely impossible," Bunday said. “Understanding the actual CD information of the lithographic features is critical to the development of physics-based lithography simulators, and these are as good as the metrics used to validate and calibrate them.†The paper also includes a brief survey of the performance of the metrology tools. This is noteworthy because it highlights some of the obstacles that need to be overcome and the technical trends that may provide solutions to current and future measurement problems. Bunday commented on various CD metrology platforms, overlay accuracy metrology tools, and defect metering systems, and concluded that most technologies are expected to extend in some form to 32 nm or below; CD-SEM will continue to evolve, and Optical CD tools will advance near the 22 nm node, although they may experience trouble after that. Part of the paper is modeling and analysis of the return on investment (ROI) of metrology tools, and introduces various methods and cost models for analyzing different metrology tools in the factory. Bunday acknowledged that collecting data for OPC, DFM, APC, and systems with random yield increases requires different platforms. In order to calculate the “added value†of these variables, it is necessary to fully understand each of them on the bottom line and ROI. Contributions. It is worth noting that although the manufacturers of metrology and process equipment have been trying their best to simplify the operational procedures of increasingly complex platforms so that they can be replaced by technicians instead of engineers, the personnel factor is still very important. As he said: "Measuring staff has the responsibility to improve the quality of the process menu of the entire tool, thus Reducing the mismatch between tools and tools, and accelerating the process of creating the process menu. To get the most value from the measurement tools, There is a need to understand all the ways that tools can have a negative impact on fab productivity.†The latest equipment is an important part of productivity, but this alone is not enough to ensure that productivity goals are achieved. Electro Hydraulic Towing Winch Electro Hydraulic Towing Winch,Fully Hydraulically Driven Tower,Towing Cable Machine,Synthetic Rope Winch TAIXING HAITAI GLOBAL TRADE CO.,LTD , https://www.haitship.com
Measurements are not cheap—the cost of metrology experts and the cost of metrology tools are not low—but if they are targeted at production and yield, then it is definitely cheap.