Mold Industry Development Trends: IC Package Automation

During the “Twelfth Five-Year Plan” period, China’s mold industry will further adjust its structure, develop new markets, work hard to improve internal skills, and raise the level of China's mold industry as a whole. This is not just a matter of the mold industry. ". The development of the mold industry and other industries can be described in terms of the lips and teeth, so the overall level of the mold industry is closely related to the development of related industries.

At present, China’s mold products are mainly dominated by medium and low grades, and the technology content is relatively low. Most high-middle-range molds rely on imports. One reason is that the related industries lack core technologies. For example, in the field of IC package molds, due to the overall level of the domestic IC industry and the reasons for foreign technology blockade, it is difficult for the IC package mold industry to develop at a high starting point. Therefore, while the IT industry and the automotive industry are driving the growth in demand for mold products, it is indispensable for both companies to increase the overall strength of China's IT industry and the automotive industry.

1. The semiconductor packaging mold is going to be automated The requirements for the mold in the semiconductor packaging mold industry are: First, the finishing mold is required. At present, electronic products are continuously integrated and miniaturized, the products tend to be high-end, the size is getting smaller and smaller, and the packaging body is getting smaller and smaller. Thin, this requires more and more packaging, and requires high precision of the mold.

The plastic mold process is one of the most important processes in the production of semiconductor devices. The single-cylinder packaging technology is generally used. The package targets include DIP, SOP, QFP, SOT, SOD, TR discrete devices, and chip tantalum capacitors and inductors. , bridge circuit and other products.

Packaging technology is constantly evolving. The chip size is reduced, the ratio of the chip area to the package area is closer to 1, the number of I/Os is increased, and the pin pitch is reduced. The development of packaging technology is inseparable from advanced electronic tooling equipment. High-tech new products such as Multi Injection Head Moulding (MGP), Automatic Punching System and Automatic Packaging System have been adapted to this demand. product.

The MGP is an extension of the single-cylinder mold technology and is the mainstream product of today's package molds. The utility model adopts a multi-barrel and multi-injection head package form, and has the advantages of equalizing flow channels, realizing close-distance filling, high resin utilization rate, stable packaging process, and good product packaging quality. It is suitable for multi-row, small-pitch, high-density integrated circuits such as SSOP, TSSOP, and LQFP, as well as miniature semiconductor device packages such as SOT and SOD.

The automatic punching and forming system is an automated device for forming the integrated circuits and semiconductor devices. High speed, versatility, and versatility are the directions for the development of this system, which can satisfy the molding of various types of lead frame carriers.

In the future, the direction of the development of semiconductor package molds will be toward the development of higher-precision and higher-speed package molds—automatic package molds. The automatic plastic packaging system is a high-precision, high-automation equipment packaged after the integrated circuit. Multiple plastic working units are set in the system, each module is equipped with a modular MGP module, and the multiple units are packaged in the order of assembly. The whole system integrates the upper sheet, the upper material, the encapsulation, the blanking, the clear mold, the debinding, and the collection. In one. This technology has developed rapidly abroad and there have been technologies such as film-covered packaging, plastic dispensing, and the like, which can satisfy the packaging of various high-density, high-lead-count products.

With the rapid development of microelectronics technology, the application technology of semiconductor post-process plastic molding equipment has been continuously improved, and automation has become an inevitable trend. As the first domestic listed company in the mold industry, Sanjia will keep a close eye on the world's advanced technologies and develop the localization of electronic molds.

2, equipment, standardization development even higher level China's mold industry has made great progress, has made great progress, but in the upper and lower reaches of the mold industry supporting links, processing equipment are mostly dependent on imports, and the machine tool is a weak link. According to Luo Baihui, in 2004, about 6 billion U.S. dollars were spent on machine tools imported into processing equipment, of which the tooling industry used most of the machine tools, which also reflected the fact that China still needs to refuel in this area. Qin Wei, deputy secretary-general of the China Die and Mould Industry Association, believes that domestic manufacturers should attach importance to the needs of the tooling industry in the equipment manufacturing industry. Currently, domestic equipment manufacturers such as Shenyang Machine Tool Group have realized the potential for “value-added” of mold and machine tools, focusing on machining centers, CNC machine tools and other equipment R & D and production. The development of machine tools in the direction of high speed, precision, high-performance specialization, systematization, and compounding has also brought new issues to domestic manufacturers.

In the field of mold standard parts, the standard mold parts with larger output in China are mainly die sets, guides, punches, etc., and oil guide plates and wedges for automobile molds. According to Luo Baihui, at present, the use coverage of China's mold standard parts in the mold is only 40%, while in Europe and the United States, it reaches 70%. Luo Baihui pointed out that standardization has become a new trend in the development of the mold industry. The mold industry should expand the variety of mold standard parts, improve its accuracy, increase production concentration, and achieve large-scale production.