Earlier we mentioned the detailed steps of cleaning the computer room, so what are the methods for cleaning the equipment in the computer room? Let's take a look.
1. Fog and columnar repeated spraying method:
This method is suitable when the dirt is thicker, first use the mist or column spray method to fully soak the dirt with the cleaning agent to achieve the purpose of initially cleaning the dirt in the deep part of the board, and then use the columnar shape. The spray method is thoroughly cleaned.
2. Top-down cleaning method:
This method is suitable for cleaning in lightly polluted conditions.
3. Bottom-up combined with top-down cleaning method:
This method is suitable for cleaning under moderate and severe pollution conditions. The bottom-up cleaning first removes most of the dirt on the equipment, which can avoid the accumulation of pollutants from top to bottom, and then thoroughly clean from top to bottom.
4. Recovery and cleaning method:
If there is a large gap between the upper and lower layers of the equipment during chemical cleaning, the time is longer and the cleaning agent flow is too large, insert anti-static absorbent paper between the cabinet layers and the bottom of the cabinet to make each layer clean the pollutants Falling on it can avoid the accumulation of pollutants from top to bottom.
5. Gap and seamless cleaning method:
For the equipment board card gap between 3~5mm, use the special spray gun for cleaning agent to enter the board room for two-way side cleaning. If there is no gap in the equipment panel, the special spray gun for cleaning agent can be used to increase the flow to clean the board from the gap between the cabinet layers or the back of the cabinet.
6. Before and after cleaning method:
For equipment where all or part of the front and rear baffles can be disassembled, the cleaning agent special spray gun is increased in flow to clean repeatedly from the front and back of the equipment. This method is the most thorough cleaning.
7. Same temperature compensation cleaning method:
In the cleaning process, when the temperature gradient of the equipment being cleaned is greater than 3°C, the same temperature compensation must be performed to prevent the electrical performance of the equipment from being altered due to excessive cooling. Strictly monitor the operation of the equipment and the environment of the machine room during the cleaning process, and report abnormal alarms and abnormal equipment operation in a timely manner. After the equipment resumes normal operation, the cleaning construction shall be resumed with the permission of Party A. Repeated self-inspection during the cleaning process. Through visual inspection and hand-cleaning inspection, the top of the rack, the inside of the rack, the circuit board, the board slot, etc. are visually identified without visible dirt, and the positioning strips, cables, and plugs on the back panel are unacceptable. Depending on the dirt.

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